An evolution of the highly successful NC258 platform, M8 brings no clean solder paste performance to the next level. Developed in combination with T4 and finer mesh leaded alloy powders, M8 provides stable transfer efficiencies required for today’s UFP and umBGA devices, reducing DPMO on the most challenging applications.
Clock fast Lead Time: In Stock Money orange $60.00
An evolution of the highly successful NC258 platform, M8 brings no clean solder paste performance to the next level. Developed in combination with T4 and finer mesh leaded alloy powders, M8 provides stable transfer efficiencies required for today’s UFP and umBGA devices, reducing DPMO on the most challenging applications.
Clock fast Lead Time: In Stock Money orange $125.00
AIM’s WS488 water soluble paste has been designed to wet virtually any solderable electronic surfaces, components, assemblies, and substrates. WS488 is compatible with all leaded and lead-free alloys, and has been developed for use in a wide range of applications.
Clock fast Lead Time: In Stock Money orange $105.00
AIM’s WS488 water soluble paste has been designed to wet virtually any solderable electronic surfaces, components, assemblies, and substrates. WS488 is compatible with all leaded and lead-free alloys, and has been developed for use in a wide range of applications.
Clock fast Lead Time: In Stock Money orange $80.00
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