Introducing LF-4300 (lead-free) and 4300 (tin-lead), two revolutionary synthetic solder pastes that offer such unparalleled versatility and forgiveness, we still don’t believe it. Both the LF-4300 and the 4300 offer true multi-process capabilities, ideal for water washable applications, able to be cleaned using standard aqueous cleaning systems without saponification. Both formulas also utilize synthetic materials that deliver ideal printing characteristics, unparalleled lot-to-lot consistency and extremely long stencil life. LF-4300 and 4300 are also VOC and halide-free, and classified as RELO.
Material Safety Data Sheets (MSDS)4300 MSDS
The print definition of LF-4300 is ideal for fine pitch applications. The stencil life of this water-soluble product virtually eliminates waste of solder paste from the printed circuit board. This type 3 solder paste will meet pitch requirements from 16 mil to 24 mil.
The following are general guidelines for stencil printer optimization with LF-4300. Some adjustments may be necessary based on your process requirements:
Automated stencil cleaning systems for both stencil and misprinted circuit boards. Manual cleaning using water at 60°C or 99% isopropyl alcohol (IPA. Post-reflow cleaning using water at 40-60°C with 30-50 PSI pressure.
Read the data sheet to find specifications about the recommended temperature profile.