It is an established fact that many defects are attributed to the solder paste printing process and solder joint formation. It is also a known fact that solder paste volume is an important predictor of good quality solder joints and long-term reliability of solder joints. Knowing that, process control has become a key element in the success of finer pitch devices, like 0201’s, CSP’s, BGA’s (ball grid array), CCGA’s (ceramic column grid array) which have known requirements for volume.
| Applications | Solder paste, red gum, stencil, bare PCB, BGA/CSP/FC |
| Measurement | Height, volume, area, 3D profile, 2D distance |
| Software Language | Chinese/English |
| Lights | Low power laser(Wavelength 660nm, Power 5mW) |
| Speed | 100 Profiles/sec |
| Resolution | Height 0.5μm, Side(X,Y):6μm |
| Repeatability | Height: < 1%, Volume: < 1% at 3 sigma |
| 3D Mode | 3D Open GL |
| Main Functions | Manual/Half-auto/Auto measurement, Fast programming / one-click repeated job on the same devices Full prototype PCB scan, zoom and navigation,3D simulation to get real paste feature, Powerful SPC functions |
| SPC Software | Product information including product name/line/paste specification/marks location stencil info, Measurement including max height/min height/average height/area/volume SPC： X-BAR,R-CHART,Histogram CP/Cpk/PP/PPK |
| Comp System | Windows XP |
| Power Supply | 85~230V，60/50Hz |
| Size & Weight | 570(W)×700(L)×450(H)mm 80kg |
