Soldering Mode | Pallet (PCB size 50*50-200*200MM) |
Solder Volume | 50kg |
Dimension | 1300(L) *580 (W) *730 (H) Net weight |
Net Weight | 90kg |
Operation Mode | Touch screen+ PLC |
Transport Speed | 0.3M-0.9M/min |
Flux Tank Capacity | 2L |
PCB Transfer Direction | From left to right |
Spraying Mode | Foam type |
Preheating Zone | One separately bottom preheating zone |
Preheating Power | 1.8 KW / part |
Preheating Temperature | Room temperature~260℃ |
Solder Pot Materials | Stainless(Standard), upgrade to titanium (Options) |
Solder Pot Heater | Heating tube |
Heater Power | 1.2KW*2PCS |
Solder Pot Temperature | Room temperature~320 |
Wave Quantity | Dual wave |
Max. Wave Height | 8mm |
Top Clearance | 40mm |
Solder Pot Heating-Up Time | 80 mins |
Solder Pot Lift | Manually |
Solder Pot In and Out | Manually |
Total Power | 4.5Kw |
Air Supply | 3-5BAR |
Power Supply | Single phase 220V 50HZ |