| Soldering Mode | Pallet (PCB size 50*50-200*200MM) |
| Solder Volume | 50kg |
| Dimension | 1300(L) *580 (W) *730 (H) Net weight |
| Net Weight | 90kg |
| Operation Mode | Touch screen+ PLC |
| Transport Speed | 0.3M-0.9M/min |
| Flux Tank Capacity | 2L |
| PCB Transfer Direction | From left to right |
| Spraying Mode | Foam type |
| Preheating Zone | One separately bottom preheating zone |
| Preheating Power | 1.8 KW / part |
| Preheating Temperature | Room temperature～260℃ |
| Solder Pot Materials | Stainless(Standard), upgrade to titanium (Options) |
| Solder Pot Heater | Heating tube |
| Heater Power | 1.2KW*2PCS |
| Solder Pot Temperature | Room temperature~320 |
| Wave Quantity | Dual wave |
| Max. Wave Height | 8mm |
| Top Clearance | 40mm |
| Solder Pot Heating-Up Time | 80 mins |
| Solder Pot Lift | Manually |
| Solder Pot In and Out | Manually |
| Total Power | 4.5Kw |
| Air Supply | 3-5BAR |
| Power Supply | Single phase 220V 50HZ |
