SN100C Lead Free Bar Solder

SN100C Lead Free Bar Solder

Part Number: SN100C-BSLF Clock fast Lead Time: 3 Weeks Pdf file Data Sheet

SN100c Bar Solder unique's properties make it possible to achieve high productivity in soldering for the printed circuit board process offering cost effective reliable joints.
  • Alloy Sn-Cu+Ni
  • Spread Factor is 77-78%
  • Melting Point:227°C/450°F
  • Available in 25 Lb box
Pricing Information
Qty:

Unit Price:
$438.00

Total: $438.00

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overview

SN100C Bar Solder gives bridge-free wave soldering at temperatures normally used with tin/lead alloys. Special features include high fluidity, low copper erosion, low drossing, superior wetting, freedom from shrinkage defects and offers great solderability for printed circuit board surfaces.

Main Features

  • Brightest, smoothest, shiniest joints of all lead free alloys
  • Lower cost than silver containing lead free alloys
  • Color: Grey

Material Safety Data Sheets (MSDS)

SN100C LF Bar Solder MSDS

specs

Alloy Copper 1 mg/mm3 Tin 2 mg/m3
Size 25 Lbs Box
Applications Wave Soldering, Manual Rework, Dip Soldering, Reflow Soldering Reactive to Equipment is LOW
Easy to maintain alloy composition Smooth, Bright Fillets Lower Drossing than other lead free alloys
Smooth, Bright Fillets
Lower Drossing than other lead free alloys
Reactive to Equipment is LOW