The NC650 No Clean Solder Paste is a modified rosin based solder paste, which allows a previously unseen level of repeatability and consistency. This solder paste offers an excellent open time, extended abandon time and good soldering activity with pin probable post soldering residues.
The performance of solder paste depends in part on the metal content, solder alloy and the solder particle size range. Increasing metal content reduces the tendency to slump and reduces the tack life of the solder paste, while the solder balling performance improves.
It is recommended to store the NC650 solder paste at 5-10°C. The solder paste should be removed from cold storage a minimum of 8 hours in the unopened container prior to use. If the solder paste does not reach room temperature, it may stick to the stencil, not deposit onto the SMT pads, de-wet pads during reflow, outgas during reflow, or produce solder balls. Avoid direct sunlight.
The SynTECH solder paste is currently available for stencil printing down to 16 mil (0.4mm) pitch devices with type 3 powder (-325+500 mesh). Printing at up to 100 mm/sec. can be reliably achieved in production using a metal squeegee blade. This is due to a unique rheology, which ensures that the higher shear rate viscosity is relatively low and the thixotropic index is high enough to ensure excellent definition and slump resistance, while maintaining good roll and drop off behavior. High squeegee pressures are not required, making the SynTECH No Clean solder paste particularly useful for second side printing processes.
The optimum temperature and humidity are 75°F and 60% or below respectively. Provided SynTECH-N solder paste is stored tightly sealed in the original container at 5-10°C, a minimum shelf life of 6 months can be expected. Air shipment is recommended to minimize the time that containers are exposed to higher temperatures.
Reflow should be performed at 35-40°C above the liquid temperature of the alloy (depending on the type of ). This temperature should be maintained for 30-45 seconds. Profiles should have less than a 3-minute preheat time above 260°F(130°C) to insure proper wetting of fine pitch leads.
If cleaning is required, use a semi-aqueous solvent or DI water with a saponifier such as Florida Cirtech RA2000 (saponifier concentration 4-6% @ 120-150°F).
This product, during handling or use, may be hazardous to health or the environment. Read the Material Safety Data Sheet and warning label before using this product.
The SynTECH solder paste is also available in: 500gram gram plastic jar. 1Kilogram, 500 gram or 250 gram cartridge for direct application. DEK ProFlow cassettes available upon request.
|Viscosity (measured at 25C using Brookfield Viscometer 670,000)||670,000cps|
|Print Speed||20-100 mm/sec.|
80 to 90 durometer or stainless steel
|Stencil Material||Stainless Steel,Molybdenum, Brass,Nickle Plated|
|Temperature/Humidity||Optimal ranges are 70-77F and 35-65%RH|
|Stencil Life (20C @ 45% RH)||+24 Hours|
|Tack Life||+48 Hours|
|Tack Force||1.6 grams/mm2|
|Room Temp., 1 hour|
|80°C, 20 minutes|
|Note: Slump is expressed as the minimum spacing between pads that does not allow bridging.|
|20 mil and greater||>4 hours|
|16 mil and less (10 mil aperture)||2 hour|
|(8 mil or less aperture)||1 hour|
|Flux Activity (per ANSI/J-STD-006)||ROL0|
|Copper Mirror (per IPC-J-STD-004)||Pass|
|Copper Plate Corrosion (per ANSI/JSTD-004)||Pass|
|Typical SIR, IPC @ 96 hours (per IPC-J-STD-004)||Pass (>2.0 X 10-9 ohms)|
|Typical SIR, IPC @ 168 hours (per IPC-J-STD-004)=||Pass (>1.5 X 10-9 ohms)|