NC160 NO CLEAN FLUX is a halide-free, no clean activated material for printed circuit board surface mounting. NC160 is formulated to work with Printed Circuit Board Assembly’s SN100C Bar Solder.

  • A solder temperature of 250-260 degrees C should be maintained
  • Excellent Solderability
  • Available 1 Gallon Container
Clock fast Lead Time: 4 Days Money orange $25.00
NC110 Low Residue NO CLEAN FLUX is a halide-free, non rosin, organic 2% solids activated material for wave soldering through-hole, mixed and for printed circuit board assemblies.

  • A solder temperature of 230-250 degrees C is recommended
  • Excellent Solderability
  • Available in 1 Gallon Container
Clock fast Lead Time: 4 Days Money orange $50.00
NC120 Low Residue NO CLEAN FLUX is a halide-free, non rosin, organic 2% solids activated material for wave soldering through-hole, mixed and for printed circuit board assemblies.

  • A solder temperature of 230-250 degrees C Recommended
  • Excellent Solderability
  • Available in 1 Gallon Container
Clock fast Lead Time: 4 Days Money orange $110.00
NC165 NO CLEAN FLUX is a halide-free, no clean activated material formulated to work with Printed Circuit Board Assembly’s SN100C Bar Solder and standard Sn/Pb Alloys. NC165 eliminates solder balls while providing excellent solderability with minimal flux residue.

  • A solder temperature of 250-260 degrees C should be maintained
  • Excellent Solderability
  • Available in 1 Gallon Container
Clock fast Lead Time: 4 Days Money orange $110.00