The PCBs, movement left to right or vice versa is controlled by the X & Y Axis, and to move the drop jet fluxer, and the solder pot up and down for height calibration by the Z axis. The PCB size that can be used on this machine are; for smaller size 50 x 50 mm, Max 350 x 260mm. If you have a board with Max700 x 260 mm, you can also solder it by doing 1 half per time.
| Operating power/Max power | 4KW/6.5KW |
| PCB dimension | 50x50---350x260mm (Can manually rotate board to 180degree to meet
x W260mm) |
| Machine dimension | W990mm x D1308mm X H1714MM |
| Net weight | 400KG |
| Power supply | 1PH 220V 50HZ MAX 30A Equip 40A contactor in factory |
| Air supply | 3-5 bars |
| Exhausting required | 200M3/h |
| PCB Robotic Platform | |
| Axes of Motion | X, Y, Z |
| Motion Control | Servo motors for X,Y,Z |
| Position Accuracy | + / - 0.05mm |
| Solder Management | |
| Standard Solder Stations | 1 |
| Solder Pot Capacity | 15 kgs |
| Solder Temperature Control | PID |
| Heat-Up Time | About 30mins |
| Max Temperature | 380 C |
| Solder Pot heater | 2kw |
| Solder Nozzles | |
| Mini Wave Nozzles | Dia 2 to 8mm |
| Customized nozzle | Available |
| Nozzle Material | Proprietary Alloy |
| (N2) Inertion Management | |
| N2 heater | Standard Equipped |
| N2 Temp PID Control Range | 0 - 350 C |
| N2 Consumption per Nozzle | 1.5m3/H |
| Required N2 Purity | >99.99% |
| Flux Management | |
| Spray Flux Nozzle | Standard equipped with drop jet nozzle made in Germany |
| Flux Capacity | 1L |
| Flux Tank | Constant pressure tank |
| Preheat | |
| IR heater | 2kw |
| Controlling System | |
| Industrial PC | Yes |
| Typical Program Time | 10 Minutes |
| Program method | Draw path in scanned picture of board |
| Controlling system | PC |