StencilQuik™ are flexible solder paste stencils manufactured from a polyimide film with a high temperature adhesive covered with a release liner. They serve as both your stencil and alignment device.

  • StencilQuik comes in a pack of 10 BGA rework stencils
  • Allows you to replace your own BGAs or CSPs without special training or large capital equipment expenditures
  • Acts as an insulating barrier between solder balls as the solder paste masks adjacent apertures increasing placement reliability
  • Simplifies BGA placement as you can "feel" the device settle into the apertures of the StencilQuik™
Clock fast Lead Time: 5 business days Money orange $77.00

These laser cut stencils are typically used to manually print a single component on a printed circuit board.

  • Maximum Size 2" x 2"
  • Available with or without flaps (Flaps facilitate handling)
  • Mainly used for PCB rework but can used for prototype PCB assembly of simple boards
Clock fast Lead Time: 24-Hour Turn Money orange $80.00

Were designed to reliably and quickly replace leadless device packages such as QFNs or LGA packages.

  • StencilMate™ comes in a pack of 20 rework stencils
  • Alignment is simple. No need to use custom fixtures or frames.
  • The stencil is cut using a laser to your exacting device requirements.
  • Eliminate the need to use capital intensive equipment or require a high degree of skill.
Clock fast Lead Time: 5 business days Money orange $80.00

StikNPeel™ greatly simplifies the ability to selectively print solder paste onto various areas of a PCB. Simply peel off the backing, place the StikNPeel™ onto the PCB and apply the paste.

  • StikNPeel comes in a pack of 10 stencils
  • This rework process overcomes many of the headaches of using metal stencils
  • Eliminates "smearing" of solder paste underneath the stencil
  • Co planarity between board and stencil is assured due to the adhesive backing on the stencil
Clock fast Lead Time: Ships with 24-48 hours Money orange $90.00
Flip-Up Stencils are single site stencils, used to apply solder paste onto circuit board pads of BGA’s, QFN’s, QFP’s, TSOPS, PLCC’s, etc.
  • Great for QFN’s where the pads on the board are larger than the pads on the component.
  • All Flip Up stencils are made from stainless steel and are reusable after a quick wash in an alcohol based cleaner.
  • All Flip Up stencils are custom made to order per your specification.
Clock fast Lead Time: 3-5 Days Money orange $110.00
CPF Stencils (or Component Print Frame) are used to apply solder paste directly onto BGA and Leadless components.
  • A CPF stencil makes for simple alignment when pasting, and serves as an excellent tool for applying paste when boards are highly populated.
  • All CPF stencils are made from stainless steel and are reusable after a quick wash in an alcohol based cleaner.
  • All CPF stencils are custom made to order per your specification.

* Orders contain stencil only. Please see accesories

Clock fast Lead Time: 3-5 Days Money orange $160.00
The StencilQuik BGA Rework Kit includes all of the materials you need to place most BGAs that you will encounter.
Clock fast Lead Time: 5 business days Money orange $200.00