The GF 125 HC Convection reflow oven for PCBs with 5 zones on top and five bottom vertical heating zones, the NEW GF-125 HC/HT is an economic solution for automatic medium volume production runs. Utilizing horizontal convection heating technology, the GF-125 HC/HT provides uniform temperature profiling across the entire PCB board for enhanced SMT process control. With temperatures up to 400°C, the GF-125 horizontal convection reflow oven is capable of lead-free soldering.
This convection reflow oven is ideal for low-volume lead-free printed circuit board soldering production lines.
This convection reflow oven is ideal for low-volume lead-free soldering production lines.
GF-DL-HT Dual Hot Plate is used for a variety of heating applications which include preheat, rework, reflow and curing of printed circuit board assemblies.The GF-DL-HT is capable of lead and lead free, high temperature applications and has dual programmable, two digital temperature controllers for precise temperature regulation.