The BGA3200 rework table include BGA mounter system, transmission system and weld system. It is use to rework and weld BGA and CSP chips. Achieve surface mounter pin and PCB surface board imaging synchronously and contraposition exactly.
Clock fast Lead Time: 2 weeks Money orange $18,750.00
The BGA3100 rework table include BGA mounter system, transmission system and weld system. It is use to rework and weld BGA and CSP chips. Achieve surface mounter pin and PCB surface board imaging synchronously and contraposition exactly.
Clock fast Lead Time: 2 weeks Money orange $15,441.18
The BGA3000 exactitude BGA-SMT orientation system uses an optic system to achieve surface component pin and PCB suface pad imaging on the CCD at the same time, and the process could be observed through the microscope.
Clock fast Lead Time: 2 weeks Money orange $9,264.71
The BGA1600C Repair workstation is a new product for the BGA chip repairing market. It deals with BGA, CSP, LGA (Land Grid Array), Micro SMD, MLF (Micro-Lead Frame), BCC (Bumped Chip Component) and assemble rework system for super dense foot chip. It is convenient and stable for all kinds of PCB, especially for large size PCBs.
Clock fast Lead Time: 10 working days Money orange $4,235.29
The BGA1600+ Repair workstation is a new product for the BGA chip repairing market. It deals with BGA, CSP, LGA (Land Grid Array), Micro SMD, MLF (Micro-Lead Frame), BCC (Bumped Chip Component) and assemble rework system for super dense foot chip. It is convenient and stable for all kinds of PCB, especially for large size PCBs.
Clock fast Lead Time: 10 working days Money orange $3,176.48
The BGA1600 Repair workstation is a new product for the BGA chip repairing market. It deals with BGA, CSP, LGA (Land Grid Array), Micro SMD, MLF (Micro-Lead Frame), BCC (Bumped Chip Component) and assemble rework system for super dense foot chip. It is convenient and stable for all kinds of PCB, especially for large size PCBs.
Clock fast Lead Time: 10 working days Money orange $2,382.35