Get 30% off on Laser Cut SMT Stencils with your PCBs
StencilQuik™ are flexible solder paste stencils manufactured from a polyimide film with a high temperature adhesive covered with a release liner. They serve as both your stencil and alignment device.
Were designed to reliably and quickly replace leadless device packages such as QFNs or LGA packages.
StikNPeel™ greatly simplifies the ability to selectively print solder paste onto various areas of a PCB. Simply peel off the backing, place the StikNPeel™ onto the PCB and apply the paste.
CPF Stencils (or Component Print Frame) are used to apply solder paste directly onto BGA and Leadless components.
* Orders contain stencil only. Please see accesories
Electroformed stencils offer the best paste release characteristics available and are frequently used for fine pitch (20 mil to 12 mil pitch) SMT applications on printed circuit boards. They are also used for µBGA's, Flip Chip, and Wafer Bumping (12 mil to 6 mil pitch).