If you are looking to reball 15 or more devices, the EZReball™ system is a convenient and easy to use reballing preform that will accurately place solder spheres on CSPs and BGAs. Each of our EZReball™ performs are custom manufactured to your component requirements.
Pricing Information

Unit Price:

Total: $175.00

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The EZReball™ reballing process allows even the beginning repair technician to reliably and quickly replace spheres on a BGA package. Alignment is simple with the edges being “squared up” with the sides of the BGA. You won’t need to buy custom fixtures or frames for your bga rework.

Since we custom make each EZReball™ perform to match your requirements, you’ll find that the solder spheres will match up to the prepped device quite easily. Once it’s reflowed, all you need to do is peel away the perform, clean it up with alcohol and your ready with the reballed device.

main Features

Manufactured to your specifications
  • EZReball™ will easily and accurately place a new array of solder balls
  • Sphere diameters from 12.0 mils to 35.0 mils
  • Can be used on CSP pitches down to 0.4mm and BGA sizes down to 6 mils
  • Exceeds both the IPC and MIL standards for purity levels and size tolerances
  • No tooling costs associated with patterns ordered
  • No custom frames or fixtures needed
  • Packaged in groups of 15
  • As an added bonus, we give you one blank perform for repairs

User Instruccions



Wick the BGA component and clean with alcohol



Apply a thin layer of water soluble paste flux to the BGA



Place BGA on top of EZReball preform



Align BGA with EZReball perform

Bga reflow oven


Reflow the BGA in a reflow oven



Remove the EZReball perform from the BGA



Clean the BGA with alcohol

Reballed bga


The reballed BGA after the EZReball method

With other stencil methods using loose solder spheres, it makes it very tedious to process one component at a time. We found out through time motion studies, that if you need to reball 15 or more devices, the EZReball method is a lot faster by 30%! Speed up device reballing by following these steps


Model EZReball™
Tensile Strength >31,800PSI @23°C, >33,300 PSI @200°C
Elongation <57% @23°C, <85% @200°C
Modulus >274 KPSI @23°C, >239 KPSI @200°C
CTE 20 ppm
Tg 351°C
Dimensional Stability @400°C less than 0.40 %
Moisture Absorption 4% maximum
Thermal Conductivity 0.17 W/ m K
UL Rating UL 94V0
Adhesive Acrylic, thermosetting, solvent resistant
Standard Alloys Melting temperature
Thermal Conductivity 0.17 W/ m K
Sn63Pb37, Leaded 183° C (361° F)