Flex-I2 Compact Dual Pot inline Hybrid Selective soldering System This system come standard with 2 solder pot in the machine. Each of them, with one individual Z axis motion. when adding an optional 2nd flux nozzle with drop jet type with individual programming flux path, for example, You can use pot-1 for leaded solder and pot-2 for lead-free. When change between lead & lead free, Just change the software to use the desire solder pot. Very easy.
If you have higher production for an smaller board, for example: less than 200mm x 400mm. you can use the same solder into pot 1 and pot2, and solder two boards in a pallet at the same time. This will double your production.
The machine has top and bottom preheater; The foldable, unique, bottom preheating zone is a very smart design. In the software programming, you can choose the process "fluxing--soldering" or "fluxing--preheating--soldering". the engineer/operator, decide if the board needs bottom preheating.
General | |
Operating power/Max power | 6KW/16KW |
Conveyor width | 80--508mm |
PCB top clearance | 100mm |
PCB bottom clearance | 35mm |
Machine dimension | 1420(L)*1725(W)*1700(H) |
Net weight | 1000KG |
Power supply | 3PH 380V 50HZ |
Air supply | 3-5 bars |
Exhausting required | 800M3/h |
PC | Yes |
Typical Program Time | 10 Minutes |
PCB Robotic Platform | |
Flux Nozzle Type | Drop jet fluxer made in Germany |
Flux Nozzle Quantity | Standard equip 1 set, optional to equip another set |
Flux Tank Capacity | 1L |
Flux Tank Quantity | Standard equip 1 set, optional to equip another set (when use two different flux) |
Flux Nozzle | Adjustable with solder pot together |
Axes of Motion | Share XYZ table with solder pot |
Position Accuracy | + / - 0.05mm |
Preheat | |
Preheating method | Top & bottom IR |
Solder Management | |
Solder pot type | Standard equipped mechanical pump, optional with electro-magnetic pump(made in Germany) |
Standard Solder Stations | 2 |
Solder Pot Capacity | 15 kgs (mechanical pump), 11kgs (electro-magnetic pump) |
Solder pot distance | 180mm--250mm (mechanical pump), 160--250mm (electro- magnetic pump) |
Soldering area |
Max PCB W450 x L508mm (18" x 20") (Two nozzle solder individually) Max PCB W235 x L508mm (9.25" x 20") (Two nozzle solder parallel) |
Solder Temperature Control | PID |
Heat-Up Time | About 30mins |
Max Temperature | 350 oC |
Mini Wave Nozzles | Dia 4,6,8,10,12mm |
Customized nozzle | Available |
Solder nozzle Distance | Adjustable by software |
Axes of Motion | X, Y, Z1, Z2 |
Motion Control | All servo control with ball screw |
Position Accuracy | + / - 0.05mm |
(N2) Inertion Management | |
N2 Consumption per Nozzle | 1.5m3/H Total: 3m3/h |
Required N2 Purity | >99.99% |