Multi-Level Stencils also known as step stencils are the solution for the new electronic assemblies which include mixed technology applications like fine pitch technology with through-hole and SMT technologies. This mix requires different amounts of solder paste for different parts.
Multi-Level Stencils can provide additional paste height in selected areas of the PCB (step-up) or reduced height deposits in other areas (step-down) in a specific section of the board.
Used to increase the volume and height of the solder deposit. Useful for ‘pin in paste’ and large format devices with co planarity consistency problems.
Used to reduce the volume and height of the paste deposit (or possibly increase the volume depending on aperture area ratio and transfer efficiency). Useful to improve Deposit Volume Repeatability in fine line and micro package attachment.
Ramped step-up areas, produced by the electroforming process, to increase paste deposits in selected areas of the stencil for large components or large features such as antenna’s or shieldings. Formed on the PCB side of the stencil to provide a smooth print surface for enclosed printheads etc while minimising smearing.
Used to overcome board surface irregularities such as raised pads, vias, legends such as bar codes and edge clamping issues. These features also afford relief for paste print deposits in two step stencil printing processes… where the use of a thin stencil is followed up by a thicker stencil in order to achieve multi height deposits without the need for "keep out areas".
|100% laser cut
|.002 - .016 inches
|Minimum Cut Width
|within .00025 inches
|Allow for Fiducial Data
|Allow for Panelized Data