Cost-effective batch reflow oven utilizing forced air convection heating technology with individual time and temperature controls makes profile set up quick and easy. The GF-B-HT is a high temperature model capable of lead and lead-free soldering.
This unique shuffle system enables a higher throughput than standard batch ovens. Both sides of the SMT reflow oven have a cooling station. While one printed circuit board is being processed, another circuit board can be cooled and off-loaded, then a third board can be loaded and shuttled into the chamber for reflow.
|CyclonicsTM (Forced Air)||1|
|Conveyor Extensions||Dual board shuttle|
|Electrical Power||15A @220 VAC, 50/60 Hz
1Ø, 2.7 Kw
|Max. Board Width||12” x 12” (305 x305mm)|
|Max. Board Height||1.250” (32mm)|
|Max. Temperature:||GF-B-HT: 600°F (315°C)|
|Venting||4” flange with integral fan|
|Heating Technology||Forced air convection|
|Heat Tunnel Length||NA|
|PC Interface Option||No|
|Overall Dimensions||38.13” x 28.13” x 14.5”H
968 x 715 x 368 mm
|Approximate Weight||102 lbs (46 kg)|