Main Features
- Outstanding reflow soldering quality for SMD and hybrid
- Cures SMD adhesive
- Two microprocessor-controlled heat zones
Power requirements | 200 – 230 VAC. / 50-60Hz |
Max. power consumption | 3680W |
Pre-heat zone | 2180W |
Reflow zone | 1500W |
Max. PCB substrate surface | 300 x 370mm |
Max. pre-heat time | 1–999sec. |
Max. pre-heat temperature | 60 -240 °C |
Max. reflow time | 1–999sec. |
Max. reflow temperature | 100–290°C |
Heat up time | approx. 8 minutes |
Net weight | +/- 22Kg |
Options (not standard) | N2 inert gas connection with flowmeter |