Are you frustrated by rework stencil printing? Are you having to perform multiple paste operations due to smeared solder paste or flux patterns? Is miniature stencil cleaning time consuming and frustrating? We have an answer to your frustrations--- the StencilQuick™ BGA Rework Stencils. This breakthrough method allows you to simplify area array device placement/replacement saving 50% or more of the time required to rework BGAs or CSPs.
These flexible solder paste rework stencils remain in place on the site location becoming an integral part of the PCB assembly.
The StencilQuick™ BGA Rework Stencils are manufactured from a polyimide film with a high temperature adhesive covered with a release liner. It is the same type of material you have been using with bar code labels and for protecting gold fingers during the wave soldering process.
These BGA Rework Stencils are laser cut from high quality, anti-static polyimide film with a residue-free high temperature adhesive backing. The StencilQuick™ BGA Rework Stencils apertures correspond to the land patterns on the PCB and define those portions of the PCB which are to have paste or paste flux applied.
Whether you are using paste flux or solder paste the StencilQuick™ BGA Rework Stencils greatly simplifies your rework process
while providing for a more reliable connection.
For more information please refer to the following links:
StencilQuik BGA Rework Stencils were specially designed to make your rework faster and simpler.
They use a breakthrough method that allows you to simplify the placement/replacement of area array devices such as BGAs and CSPs as well as other leaded SMT devices.
Eliminate hours of solder mask damage repair time for BGA sites while improving rework yield. StencilQuik™ serves as both your stencil and alignment device. As an added bonus the stencil acts as an insulator between interconnects preventing shorts between balls thereby increasing the reliability of the reworked device. The benefits of StencilQuick™ process are many:
To order your custom BGA rework StencilQuik please select the Ball Count (The price is based on the ball count) and upload the datasheet or Gerber file for your BGA component.
The StencilQuik part number is optional. If you are providing the StencilQuik part number you do not need to upload any file.
And if you upload a file you don't need to provide the part number. But it is REQUIRED to provide at least ONE of both. Standard lead time is (5) business days, 24-48hr expedites are also available. Stencil Quik comes in a pack of 10 BGA rework stencils
|Up to 425
|426 to 600
|601 to 960
|960 to 1400
|1401 to 2000
BGA rework stencils come in (2) thicknesses-0.004" and 0.008" thick.
|Minimum Aperture Size
|.Plastic film with release liner. Adhesive is a low tack sticky note type of adhesive.
|Maximum Stencil Size
|Approx 4 x 4in (100mm x 100mm)
We accept either standard GERBER files, part data sheets or CAD files.