HBS-A3 Hot Bar Soldering Device

HBS-A3 Hot Bar Soldering Device

Part Number: HBS-A3 Pdf file Data Sheet
HBS-A3 Hot Bar Soldering Machine use thermode technology that based on rapid reflow by pulse heating to effectively solder flexible board on the PCB. Real time display on the touchscreen. CCD+displayer can accurate positioning and soldering quality check.
Pricing Information
QTY:
Unit Price:
$8,500.00
Total: $8,500.00

Product Accessories for HBS-A3 Hot Bar Soldering Device

Customized Fixture for HBS-A3

Customized Fixture for HBS-A3

Price: $600.00
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Customized Soldering Tip for HBS-A3

Price: $300.00

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Application

HBS-A3
HOT BAR SOLDERING DEVICE

Overview

Thermode technology that based on rapid reflow by pulse heating to effectively solder flexible board on the PCB, with Real time display on the touch screen. CCD + displayer can accurately positioning and soldering.

This machine can handle PCBs up to 200 x 170 mm, Lead-free compatible.

Main Features

CCD+Display for
accurate positioning
  • Lead-free compatible hot bar process of flex-to-PCB can replace more costly Flex-Printed Circuits and save the cost of PCB connectors. Process also conserves vertical height of assemblies
  • Customized soldering head press all of the soldering joints of parts on the PCB to solder it simultaneously by heating them to a temperature, it greatly improves soldering efficiency
  • The heating up rate is adjustable to meet different requirement of application
  • Molybdenum alloy head to ensure temperature stability, fast heating speed and long lifetime
  • The level of soldering head is adjustable , to ensure that part assembly process is uniform
  • Digital temperature controller with precise PID control ,ensure soldering quality
  • Equipped with CCD and display ,convenient for accurate positioning and soldering quality check
  • Preheat and reflow profile can be set and displayed on the touch screen control panel

specs

Working Area Max 170*200mm
Y-axis movement mode Cylinder
Power AC220V±10% 50HZ,2300W
Temperature setting RT ~ 500 ± 5 DEG C.
Soldering Pressure 0.45-0.70Mpa
Heating Rate 250ºC/s
Soldering Time 1-99. 9S
Soldering pressure 1~20kg
Machine weight 75 KG
Machine Size 660*660*700mm
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