VSP 870 Vertical Cleaner for Stencil & PCBA

VSP 870 Vertical Cleaner for Stencil & PCBA


VSP 870 use water based liquid for screen stencil, printing scraper cleaning. The equipment can realize automatic cleaning, rinsing and drying process according to preset program.
Pricing Information
QTY:
1


Overview

Stencil cleaning is crucial in surface mount technology to ensure accurate solder paste application. During the printing process, solder paste can accumulate on the stencil's apertures, leading to solder coats, bridging, and other defects in the solder joints. To avoid such issues, regular cleaning is necessary. The VSP-870 Double liquid tank with heaters, uses water-based liquid for screen/stencil, PCBA, printing scraper cleaning. The equipment can realize automatic cleaning, rinsing and drying process according to pre-set program.


Main Features

  • Max stencil size : 800mm(L) x 750mm(W) x 40mm(H)
  • Cleaning process: High pressure jet liquid cleaning - chemical insolation - DI water rinsing - hot air drying.
  • Cleaning liquid pressure is adjustable.
  • Monitor resistivity of rinsing DI water in real time .
  • Filter lifetime monitoring .
  • Efficiency : 8-15 min/pcs
  • PLC + touch screen control, full English interface

specs

Max Product Size 800mm (L)×750mm (W)×40mm (H)
Cleaning Tank Capacity 50 Liters
Cleaning Method High Pressure Jet Liquid
Drying Method Hot Air
Cleaning Liquid Filtering 0.22um Filter
Cleaning Time Solder Paste 8-10 Min, Red Glue 15 Min.
Dilution Liquid Heating Temperature RT+15~70 °C
Resistivity Meter Monitoring Range 1mΩ~18mΩ.cm
DI Water Supply 15~50L/min
DI Water Pressure 0.2-0.4 Megapascal (MPA)
DI Water Entrance Pipe Connection ¾ Inch
Power Supply 3Phase 380V 50/60HZ
Weight Approx 500Kg
Exhaust Size Φ 124mm (W) × 30mm (H)
Machine Size 1560mm(L) ×1160mm(W) ×1850mm(H)
Exhaust Flowrate Requirement 20M3/Min
Cleaning Liquid Consumption 20ml--300ml/batch, according to products.
DI Water Consumption 40L/Rinsing for 3 Times
×