Printed Circuit Board SMT Stencils

These frameless stencils are specifically designed to manually print solder paste onto printed circuit boards.

• Printed circuit board stencils eliminates tedious hand soldering of PCBs
• Reduce PCB prototype assembly time
• Available with or without flaps

** The stencil kit comes with a squeegee blade and board holders.
** Using printed circuit board SMT stencils with a Toaster Reflow Oven will make your prototype PCB assembly job easier and save you time.
** We are backing that with a money-back guarantee program.

Our stainless steel stencils were specially designed for the Maker’s market so everyone can have access to a high quality SMT stencil at a low price.

• Eliminates tedious hand soldering of prototype PCB boards
• Reduce PCB prototype assembly time
• Better quality than a Mylar or Kapton stencil
• Starts at $20

These are very low cost SMT Stencils specifically designed to manually print solder paste onto printed circuit boards.

• Eliminates tedious hand soldering of prototype circuit boards
• Lower cost than stainless steel stencils
• Cut with a UV laser for optimal performance

StencilQuik™ are flexible solder paste stencils manufactured from a polyimide film with a high temperature adhesive covered with a release liner. They serve as both your stencil and alignment device.

• StencilQuik comes in a pack of 10 BGA rework stencils
• Allows you to replace your own BGAs or CSPs without special training or large capital equipment expenditures
• Acts as an insulating barrier between solder balls as the solder paste masks adjacent apertures increasing placement reliability
• Simplifies BGA placement as you can "feel" the device settle into the apertures of the StencilQuik™

These laser cut stencils are typically used to manually print a single component on a printed circuit board.

• Maximum Size 2" x 2"
• Available with or without flaps (Flaps facilitate handling)
• Mainly used for PCB rework but can used for prototype PCB assembly of simple boards

Were designed to reliably and quickly replace leadless device packages such as QFNs or LGA packages.

• StencilMate™ comes in a pack of 20 rework stencils
• Alignment is simple. No need to use custom fixtures or frames.
• The stencil is cut using a laser to your exacting device requirements.
• Eliminate the need to use capital intensive equipment or require a high degree of skill.

StikNPeel™ greatly simplifies the ability to selectively print solder paste onto various areas of a PCB. Simply peel off the backing, place the StikNPeel™ onto the PCB and apply the paste.

• StikNPeel comes in a pack of 10 stencils
• This rework process overcomes many of the headaches of using metal stencils
• Eliminates "smearing" of solder paste underneath the stencil
• Co planarity between board and stencil is assured due to the adhesive backing on the stencil

Flip-Up Stencils are single site stencils, used to apply solder paste onto circuit board pads of BGA’s, QFN’s, QFP’s, TSOPS, PLCC’s, etc.

• Great for QFN’s where the pads on the board are larger than the pads on the component.
• All Flip Up stencils are made from stainless steel and are reusable after a quick wash in an alcohol based cleaner.
• All Flip Up stencils are custom made to order per your specification.

These laser cut stencils are designed to work with stencil tensioning systems also known as Reusable Stencil Frames like the Wizard Frame.

• Reduces storage space requirements
• Significantly less expense than framed stencils
• Smooth aperture walls and can be used for 16 Mil pitch and below and for Micro BGA"s

** Frameless SMT Stencils are recommended for prototype printed circuit board assembly or short runs.

CPF Stencils (or Component Print Frame) are used to apply solder paste directly onto BGA and Leadless components.

• A CPF stencil makes for simple alignment when pasting, and serves as an excellent tool for applying paste when boards are highly populated.
• All CPF stencils are made from stainless steel and are reusable after a quick wash in an alcohol based cleaner.
• All CPF stencils are custom made to order per your specification.

* Orders contain stencil only. Please see accesories

These solder paste stencils are designed for high volume screen printing on printed circuit boards.

• Foils are permanently mounted into aluminum frames
• Provide optimum solder paste volume control
• Large variety of standard frames for every printer

** Framed stencils have smooth aperture walls and can be used for 16 Mil pitch and below and for Micro BGA"s.

These Multi-level Stencils offer superior flexibility in achieving the right solder paste volume deposit for components with diverse paste requirement.

• Provide optimum solder paste volume control
• Eliminate co-planarity problems
• Foils are permanently mounted into aluminum frames

An alternative to Electroform Stencil, UltraSlic™.

UltraSlic™ FG outperforms all other existing stencil technologies on the market today, and it can be shipped in 48 hours turnaround times.

• Fine Grain stainless steel with superior fatigue strength, super smooth surface and elevated wear factor
• Superior paste release below surface area ratios of 0.5
• Higher performance and lower cost compared to electroform, the option of step stencils

Electroformed stencils offer the best paste release characteristics available and are frequently used for fine pitch (20 mil to 12 mil pitch) SMT applications on printed circuit boards. They are also used for µBGA's, Flip Chip, and Wafer Bumping (12 mil to 6 mil pitch).

• The smooth trapezoidal sidewalls of an electroformed stencil allow for better paste release
• Nickel has a lower coefficient of friction compared to stainless steel
• Electroform foils are harder than full hard stainless steel of comparable thickness, providing for longer stencil life

Electroformed Frameless Stencils are nickel-based, electroform foils designed to work with stencil tensioning systems also known as Reusable Stencil Frames. They do not need to be permanently glued in a frame. Electroformed stencils offer the best paste release characteristics available and are frequently used for fine pitch (20 mil to 12 mil pitch) SMT applications on prototype printed circuit boards. They are also used for µBGA's, Flip Chip, and Wafer Bumping (12 mil to 6 mil pitch).