BGA1600C Exact Maintenance System

BGA1600C Exact Maintenance System

Part Number: BGA1600C Clock fast Lead Time: 10 working days

The BGA1600C Repair workstation is a new product for the BGA chip repairing market. It deals with BGA, CSP, LGA (Land Grid Array), Micro SMD, MLF (Micro-Lead Frame), BCC (Bumped Chip Component) and assemble rework system for super dense foot chip. It is convenient and stable for all kinds of PCB, especially for large size PCBs.
Pricing Information

Unit Price:

Total: $4,235.29

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Main Features

Adopts best heating
material to control disassemble and weld for BGA
  • Hot air and temperature can be adjusted, and the generated high temperatures rotates air.
  • Moving heating head, easy operation.
  • There are two independent heating zones one in the top and one in the bottom. The first heating zone can control temperatures, and the second heating zone can take PCBs heat to get the best welding effect.
  • There are different temperature profiles in the top and bottom. A Large powered motor fan can cool rapidly PCBs to perfection.
  • The max PCB is 17.71" x 15.74" or 450mm x 400mm
  • Capable of adjusting PCB's frames with anti-scald protection design.
  • Support frame in the BGA welding district, adjust support height to avoid going down from the welding district.
  • 20 segments warm-up control, it can save 2 groups setting temperature profiles.
  • Adopt import high precision thermocouple to achieve inspect temperature minutely.
  • With an alarm and reminder functions after disassembly and weld. The circuit can cut off when short circuit, and with super temperature protection function.
  • With computer communication function, PC serial port inside, temperature interface outside, with a software to achieve computer control.
  • Hot air nozzle with different sizes. It is easy to replace.
  • Hand vacuum absorb pen to absorb BGA, the suction can be adjusted.
  • With head lamp to increase ray in the working district.
  • It is suitable for lead and lead free welding.


Input Voltage AC220V 50/60Hz 10A
System Power 2000W
Pre-heating Power in the Bottom/Highest Temperature 1200W/350
Pre-Heating Area in the Bottom 9.44" x 9.44" or 240mm x 240mm
Hot Air Power on the Top/Highest Temperature 800W/450
Temperature Feedback RTD sensor, close loop control
Flux in the Hot Air Head 8,16,24 L/Minute can be chosen
Max Chip Size 2.75" x 2.75" or 70mm x 70mm
Min Chip Size 1mm x 1mm
Max Chip Weight 55g
Max PCB Size 13.77" x 13.77 or 350mm x 350mm
Max Thickness of PCB 3mm
Suitable Chip BGA, CSP, LGA( Land Grid Array), Micro SMD,MLF?BCC
Dimension 21.45" x 17.32" x 19.21" or 545mm x 440mm x 488mm
Weight About 55.11Lb or 25 Kgs
Adjustment Accuracy 0.025mm
Min Foot Space 0.3mm