The BGA3100 rework table include BGA mounter system, transmission system and weld system. It is used to rework and weld BGA and CSP chips. Achieve surface mounter pin and PCB surface board imaging synchronously and contraposition exactly. Accomplish BGA chips unsoldering and rewelding. It is similar to high precision components, such as QFP and PLCC.
Dimensions | 43.30" x 28.34" x 24.40" or 1100mm x 720mm x 620mm |
Weight | About 264.55Lb or 120kg |
Total Power | 1800W |
Nozzle Heating | 550W |
Bottom Warm-Up | 1200W |
Pressure | 220V/50HZ |
PCB Size | Max 9.84" x 11.81" or 250mm x 300mm, Min 1.18" x 0.32" or 30mm x 10mm |
PCB Thickness | 0.5-3mm |
Mounter Size | Max 0.7" x 0.7" or 18mm x 18mm, Min 0.27" x 0.27" or 7mm x 7mm(1.88" x 1.88" or 48mm x 48mm optional) |
Mounter Precision | 10um |
Picking-Up Power | 1.0N |
Temperature Control System | Model K intelligent system, closed loop control |
Contraposition System | Automatic contraposition |
PCB Transmission & Drive System | Precisely manual move |
Contraposition Drive System | Step motor laser |
Planting Ball Table Configuration | Optional |
PCB Transmission System | Manual |